Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Product Code: 335224B00032G
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Delivery terms
Product will be ordered from supplier. If the supplier is unable to deliver by the specified date, we will inform you by e-mail
 Not available | Supplier Warehouse |
Home delivery
Home delivery
After handing over the goods to the courier, we will inform you by e-mail.
Over €25.00 (Orders up to 1000 kgs) | For free |
To €25.00 (Orders up to 1000 kgs) | €4.50 |
Delivery to DPD pickup locations
Delivery to DPD pickup locations
After handing over the goods to the courier, we will notify you by e-mail. Free delivery for orders over 25€.
€3.50
Product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Useful information
Specifications
SKU
U-2467172
Product code
335224B00032G
Supplier product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Useful information
Supplier parameters
Product code
335224B00032G
Product ID
U-2467172
Application
BGA
Colour
black
Heatsink shape
grilled
Height
9.91mm
Length
25.02mm
Manufacturer
BOYD CORP
Material
aluminium
Material finishing
anodized
Type of heatsink
extruded
Width
25.02mm
Supplier's product code
335224B00032G
The information that supplier provides may differ from the actual product. If you noticed an error please let us know by email: [email protected].
