Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm BOYD CORP
Product Code: EA-270-H175-T710
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Delivery terms
Product will be ordered from supplier. If the supplier is unable to deliver by the specified date, we will inform you by e-mail
 Not available | Supplier Warehouse |
Home delivery
Home delivery
After handing over the goods to the courier, we will inform you by e-mail.
Over €25.00 (Orders up to 1000 kgs) | For free |
To €25.00 (Orders up to 1000 kgs) | €4.50 |
Delivery to DPD pickup locations
Delivery to DPD pickup locations
After handing over the goods to the courier, we will notify you by e-mail. Free delivery for orders over 25€.
€3.50
Product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm BOYD CORP
Specifications
SKU
U-2466757
Product code
EA-270-H175-T710
Supplier product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Supplier parameters
Product code
EA-270-H175-T710
Supplier's product code
EA-270-H175-T710
Product ID
U-2466757
#Promotion
aac_202202
Application
BGA
Colour
black
Heatsink shape
grilled
Height
17.5mm
Length
27mm
Manufacturer
BOYD CORP
Material
plastic
Material finishing
anodized
Type of heatsink
extruded
Unit price
No
Width
27mm
The information that supplier provides may differ from the actual product. If you noticed an error please let us know by email: [email protected].
