DEV KIT, WIRELESS CONNECTIVITY
Toote kood: TDGL021
Bränd
Rohkem sarnaseid tooteid
Kättetoimetamise tähtajad
Kaup tellitakse tarnija laost. Kui tarnijal ei ole võimalik tarnida kaupa näidatud kuupäevani, informeerime teid epostitsi.
 Ei ole saadaval | Tarnija ladu |
Kulleriga koju
Kulleriga koju
Üle 25,00 € (Tellimused kuni 1000 kgs) | Tasuta |
25,00 €-le (Tellimused kuni 1000 kgs) | 4,50 € |
Kohaletoimetamine DPD pakiautomaatidele
Kohaletoimetamine DPD pakiautomaatidele
Pärast kauba kullerile üleandmist teavitame teid sellest e-posti teel.
3,50 €
Tarnija toote kirjeldus
DEV KIT, WIRELESS CONNECTIVITY; Kit Application Type:Wireless Connectivity; Silicon Manufacturer:Microchip; Silicon Core Number:PIC32MX695F512L; Application Sub Type:WiFi; Kit Contents:Dev Board PIC32MX695F512L; Product
Tarnija toote parameetrid
Product code
TDGL021
Brand
MICROCHIP
Supplier's product code
2424217
Product ID
U-1071079
The information that supplier provides may differ from the actual product. If you noticed an error please let us know by email: [email protected].
![EMC half screw connection Pg21, for metal housings of sizes 2-4, consisting of rubber seal, iris spring, cone disks and pressure screw, for size 1 housings, cable shielding range [mm] 10.5 - 14.5, cable [mm] 14-18](https://cdn.lemona.lt/display?url=https://www.lemona.ee/media/catalog/product/placeholder/default/new_placeholder_2_1.png&q=80&w=187)
